One-glance verdict
$47.21 our estimate vs market $114.19
Wall Street consensus: $100.00 (111.8% higher than our fair-value estimate)
142% above our estimate, beyond the bull case
Fundamentals snapshot
KLIC · NMS · Technology · Semiconductor Equipment & Materials
Current price
$114.19
52-week range
$31.32 - $115.15
Market cap
$5.98B
One-glance verdict
Wall Street consensus: $100.00 (111.8% higher than our fair-value estimate)
142% above our estimate, beyond the bull case
Balance sheet
Net cash $448.08M. Interest coverage shows how many times profit covers the interest bill.
What stands out
What this company does
Kulicke and Soffa manufactures the essential machinery and tools that other companies need to assemble semiconductors, which are the tiny electronic brains found in devices like smartphones and cars. The company earns money primarily by selling this expensive equipment, but also profits from selling the necessary parts and providing services for those machines after the sale. Because their products are a critical part of the electronics supply chain (the entire network of businesses involved in creating and distributing a product), the company's performance often reflects the overall demand for new technology worldwide.
Kulicke and Soffa, started in 1951 by two engineers in a small Philadelphia shop, became a key player in the electronics revolution. They invented the first 'wire bonder,' a machine that automated the delicate process of connecting tiny wires to semiconductor chips, which was crucial for mass-producing electronics. Over the years, the company continued to innovate, creating faster and more precise machines that became industry standards. As the chip industry moved to Asia, Kulicke and Soffa followed, establishing a major presence in Singapore, which is now its headquarters.
Think of every electronic device you own—your phone, your car, your computer. Inside are tiny electronic chips that need to be connected to work. Kulicke and Soffa builds the highly specialized, robotic machines that make these microscopic connections. These machines precisely place chips onto circuit boards and then connect them with incredibly thin wires or through other advanced methods. The company also sells the tiny tools and parts these machines use up (consumables) and provides services to keep the machines running smoothly.
This is the company's traditional and largest business, making machines for a process called ball bonding. This technique uses heat, pressure, and ultrasonic energy to melt the tip of a very thin gold or copper wire into a tiny ball, which is then attached to the semiconductor chip to create an electrical connection. These machines are the workhorses for assembling a huge variety of chips used in everything from computers to smartphones. Customers are mainly the large factories that assemble and test chips for other companies (known as outsourced semiconductor assembly and test providers, or OSATs) and companies that manufacture their own devices.
This segment produces machines that use a different connection method called wedge bonding, which is especially important for electronics that handle a lot of power, like those in electric vehicles and industrial machinery. Instead of a ball, these machines use a wedge-shaped tool to press the wire onto the chip and the package, creating a strong, reliable bond with aluminum or copper wires and ribbons. This part of the business serves the growing market for power semiconductors, which are critical components in managing electricity in modern cars and industrial systems.
This is the company's high-growth area, focused on the newest and most complex ways to assemble chips. As electronics get smaller and more powerful, traditional wire connections are not always enough. This segment provides equipment for advanced techniques like 'thermo-compression bonding' (using heat and pressure to connect chips) and systems for assembling advanced displays and other complex electronic components. These solutions are critical for building the powerful chips needed for artificial intelligence (AI), high-performance computing, and advanced memory.
This part of the business supports customers after they've bought a machine. It provides all the necessary spare parts, tools that wear out with use (like the tiny nozzles, or 'capillaries,' that guide the wires), and maintenance services to keep the equipment running efficiently. This creates a steady, recurring stream of revenue (income that is predictable and likely to continue in the future) because customers constantly need to replace parts and service their machines to keep their factories productive. This segment is important for building long-term customer relationships and provides a more stable income source compared to the cyclical nature of equipment sales.
The company is heavily focused on growing its 'Advanced Solutions' business to meet the demands of the most powerful new technologies. This includes investing in equipment for things like artificial intelligence and high-performance computing, which require more complex chip assembly methods than traditional wire bonding. Management is also targeting the rapidly growing market for electric vehicles and other power electronics, where its wedge bonding technology is essential. By expanding into these higher-growth areas, the company aims to become a key partner for manufacturers building the next generation of electronic devices.
Price history
Earnings history
Click any quarter to read the call summary and what the numbers say.
Is it cheap or expensive?
Wall Street consensus is the average analyst price target: $100.00 (111.8% higher than our fair-value estimate).
Our most-likely fair value is $47.21 a share — about 58.7% below today's price of $114.19, so the stock currently looks expensive (overvalued).
Is it drowning in debt?
Net cash $448.1M - more cash than debt. Interest coverage -294.0x.
Kulicke and Soffa Industries, Inc.'s profit covers its interest bill about 0.0 times over. which is weaker than most peers shown here and 1 peers sit below 1x, which is the danger zone where profit does not fully cover the interest bill.
Total debt $39.79M Interest coverage -293.99x This is the baseline the peer rows are being compared against.
Total debt $601.03M Interest coverage 6.90x This peer still has a real interest-payment cushion, while KLIC does not.
Total debt $487.81M Interest coverage 77.42x This peer still has a real interest-payment cushion, while KLIC does not.
Total debt $330.08M Interest coverage -29.03x Neither company has much profit cushion over interest right now.
Total debt $31.89M Interest coverage 115.35x This peer still has a real interest-payment cushion, while KLIC does not.
Total debt $3.76B Interest coverage 4.62x This peer still has a real interest-payment cushion, while KLIC does not.
What you should know
The numbers
Tap any ? icon to learn what it means.
Valuation
Profitability
Health
Growth
Cash flow
Dividend
Metric explainer
Debt comparison
What you should know